Marking its third joint venture, startup Rohinni partners with Beijing-based BOE to develop miniLED and microLED-based LCD displays and video walls.
Marking its third joint venture, startup Rohinni partners with Beijing-based BOE to develop miniLED and microLED-based LCD displays and video walls.
Vishay’s dual n-channel 60-V MOSFET delivers increased power density and efficiency for a range of applications, including battery management systems, plug-in and wireless chargers, DC/DC converters, and power supplies.
The ams AS5950 sensor chip combines a photosensor array and an ADC in a single chip, which reduces the complexity of the sensor assembly in 8- and 16-slice CT scanners.
Vishay’s dual n-channel 60-V MOSFET delivers increased power density and efficiency for a range of applications, including battery management systems, plug-in and wireless chargers, DC/DC converters, and power supplies.
The ams AS5950 sensor chip combines a photosensor array and an ADC in a single chip, which reduces the complexity of the sensor assembly in 8- and 16-slice CT scanners.
Infineon Technologies has added a medium-power device to its TRENCHSTOP IGBT7 family, enabling a 30 percent higher inverter output current.
Viavi expands the functionality of two radio test set offerings to support Hytera DMR radios and repeaters.
Skyworks’ 5-GHz front-end module for Wi-Fi 6 integrates a 5-GHz transmit/receive switch, a 5-GHz low noise amplifier with bypass, and a 5-GHz power amplifier.
Infineon Technologies has added a medium-power device to its TRENCHSTOP IGBT7 family, enabling a 30 percent higher inverter output current.
Viavi expands the functionality of two radio test set offerings to support Hytera DMR radios and repeaters.
Skyworks’ 5-GHz front-end module for Wi-Fi 6 integrates a 5-GHz transmit/receive switch, a 5-GHz low noise amplifier with bypass, and a 5-GHz power amplifier.
Here’s a recap of Electronic Products’ top 10 component lists of 2019.
Here’s a recap of Electronic Products’ top 10 component lists of 2019.
Here are five component trends for the new year, ranging from LiDAR sensors in vehicles to lithium-sulfur batteries.
Here are five component trends for the new year, ranging from LiDAR sensors in vehicles to lithium-sulfur batteries.
ams released Raspberry Pi and Arduino-based NanEyeC evaluation kits to help implement
eye tracking, presence detection, and object recognition in a range of products, including virtual reality headsets, smart lighting, and home and building automation.
ams released Raspberry Pi and Arduino-based NanEyeC evaluation kits to help implement
eye tracking, presence detection, and object recognition in a range of products, including virtual reality headsets, smart lighting, and home and building automation.
Component manufacturers never stop innovating, and 2019 was another banner year in terms of new innovations, ranging from 3D imaging and haptic devices to mmWave components and 5G chipsets.
ams released Raspberry Pi and Arduino-based NanEyeC evaluation kits to help implement
eye tracking, presence detection, and object recognition in a range of products, including virtual reality headsets, smart lighting, and home and building automation.
Component manufacturers never stop innovating, and 2019 was another banner year in terms of new innovations, ranging from 3D imaging and haptic devices to mmWave components and 5G chipsets.
ams released Raspberry Pi and Arduino-based NanEyeC evaluation kits to help implement
eye tracking, presence detection, and object recognition in a range of products, including virtual reality headsets, smart lighting, and home and building automation.
The last installment of a three-part series on the advantages of MIMO looks at advanced MIMO applications and explores multi-user and massive MIMO systems.
The last installment of a three-part series on the advantages of MIMO looks at advanced MIMO applications and explores multi-user and massive MIMO systems.
GaN Systems and ON Semiconductor have created a 300-W AC adapter reference design, leveraging GaN Systems’ GaN E-HEMTs and ON Semiconductor’s controller and driver ICs.
DC/DC buck converters drive single LEDs and multiple LED strings for interior and exterior automotive LED lamps.
Atom Switch’s UL-listed second-generation digital circuit breaker delivers performance improvements, including additional firmware capability and increased interrupting rating.
Delivering size, weight, and costs savings, ams claims the first inductive position sensor for high-speed, automotive, and industrial electric motors.
In addition to improving power efficiency, the Maxim Integrated gate driver reduces power loss by 30%, while increasing system uptime.
If you miss using classic curve tracers, you’re going to love the new Keithley I-V Tracer software that brings back many of the key features of these testers.
In Part 2 of a three-part series on the advantages of MIMO, high-level calculations for implementing MIMO, including the key issue of channel characterization, is covered in detail.
Renesas’s new RV1S92xxA and RV1S22xxA photocouplers reduce PCB mounting area by 35 percent.
The highly-Integrated LTM4668 and LTM4668A regulators from Analog Devices Inc. reduce component count, board space, and power usage.
Artilux claims the industry’s first CMOS-based ToF sensor that can work with optical wavelengths up to 1.55 µm, improving eye safety, sensing accuracy, and performance under sunlight.
u-blox has extended its Bluetooth BMD-3 series family with an ultra-small and high-performance Bluetooth Low Energy 5.0 module.
ON Semiconductor has rolled out its first two devices in its new VE-Trac family of power modules, aimed at the automotive traction inverter market.
ON Semiconductor has rolled out its first two devices in its new VE-Trac family of power modules, aimed at the automotive traction inverter market.
Part 1 of a three-part series on MIMO systems explains how modern MIMO techniques take advantage of increased signal-processing power and integrated transceivers to improve channel reliability and increase data rates.
Part 1 of a three-part series on MIMO systems explains how modern MIMO techniques take advantage of increased signal-processing power and integrated transceivers to improve channel reliability and increase data rates.
Renesas’ new low-power prototyping board and Bluetooth LE expansion board enables faster and easier IoT endpoint equipment prototyping.
Renesas’ new low-power prototyping board and Bluetooth LE expansion board enables faster and easier IoT endpoint equipment prototyping.
Selecting the right collaboration software requires a balance of choices between your product development team’s needs today and in the future.
Selecting the right collaboration software requires a balance of choices between your product development team’s needs today and in the future.
OmniVision claims the industry’s first 8.3-MP automotive image sensors with LED flicker mitigation and 140-dB high dynamic range.
OmniVision claims the industry’s first 8.3-MP automotive image sensors with LED flicker mitigation and 140-dB high dynamic range.
STMicroelectronics’ fully integrated power management IC saves board space and cuts power consumption in application-processor based systems.
STMicroelectronics’ fully integrated power management IC saves board space and cuts power consumption in application-processor based systems.
The Boréas chip-scale haptic IC with very low-power consumption targets the smallest mobile and wearable electronics devices including buttonless smartphones, smartwatches, and game controllers.
The Boréas chip-scale haptic IC with very low-power consumption targets the smallest mobile and wearable electronics devices including buttonless smartphones, smartwatches, and game controllers.
Nexperia claims the fastest common mode filter with ESD protection and the widest differential passband up to 10 GHz 3 dB frequency for Super Speed USB.
Renesas’ 32-bit RX23W microcontroller combines Bluetooth 5.0 with Trusted Secure IP for IoT endpoint devices such as home appliances and health-care equipment.
Nexperia claims the fastest common mode filter with ESD protection and the widest differential passband up to 10 GHz 3 dB frequency for Super Speed USB.
Renesas’ 32-bit RX23W microcontroller combines Bluetooth 5.0 with Trusted Secure IP for IoT endpoint devices such as home appliances and health-care equipment.
Part 2 in a series of articles on motor control design focuses on how to reduce noise, one of the biggest challenges, in stepper motors.
Part 2 in a series of articles on motor control design focuses on how to reduce noise, one of the biggest challenges, in stepper motors.
Microchip claims up to 25 percent cost savings with its new SPI EERAM memory compared to serial NVRAM devices.
Littelfuse’s POWR-SPEED PSR series of semiconductor fuses now includes new bolted and DIN blade models in various sizes and amperages.
Vishay’s SurfLight IR emitters deliver 30% higher brightness than previous generation devices over a wide operating temperature range of -40°C to 110°C.
C&K’s NanoT series of tactile switches targets space-constrained applications, including wearable medical devices and smartwatches.
Microchip claims up to 25 percent cost savings with its new SPI EERAM memory compared to serial NVRAM devices.
Platform-based test workflow breaks down homegrown test environment silos and fosters software reuse, resulting in a faster time to market, increased productivity, and improved cost efficiency.
Platform-based test workflow breaks down homegrown test environment silos and fosters software reuse, resulting in a faster time to market, increased productivity, and improved cost efficiency.
Intertek launched its Cyber Assured cybersecurity product testing and certification program that provides continuous vulnerability monitoring for connected consumer products.
Intertek launched its Cyber Assured cybersecurity product testing and certification program that provides continuous vulnerability monitoring for connected consumer products.
Intertek launched its Cyber Assured cybersecurity product testing and certification program that provides continuous vulnerability monitoring for connected consumer products.
Intertek launched its Cyber Assured cybersecurity product testing and certification program that provides continuous vulnerability monitoring for connected consumer products.
Soitec and Applied Materials have formed a joint development program to develop next-generation silicon carbide (SiC) substrates for power devices used in electric vehicles, telecommunications, and industrial applications.
Soitec and Applied Materials have formed a joint development program to develop next-generation silicon carbide (SiC) substrates for power devices used in electric vehicles, telecommunications, and industrial applications.
MediaTek claims the industry’s most advanced 5G chipset family with the launch of its Dimensity lineup, starting with the Dimensity 1000 5G mobile SoC.
A new analyze-first approach to voice wakeup device architecture uses 10x less power than a digitize-first-based approach to always-on listening, and uses localized intelligence to select and send only the relevant data to the cloud.
MediaTek claims the industry’s most advanced 5G chipset family with the launch of its Dimensity lineup, starting with the Dimensity 1000 5G mobile SoC.
MediaTek claims the industry’s most advanced 5G chipset family with the launch of its Dimensity lineup, starting with the Dimensity 1000 5G mobile SoC.
A new analyze-first approach to voice wakeup device architecture uses 10x less power than a digitize-first-based approach to always-on listening, and uses localized intelligence to select and send only the relevant data to the cloud.
Nvidia released a new reference design platform with hardware and software building blocks that enables designers to use Nvidia GPUs with Arm-based processors in high performance computing.
Nvidia released a new reference design platform with hardware and software building blocks that enables designers to use Nvidia GPUs with Arm-based processors in high performance computing.
Powerbox claims the industry’s first power supply for immerged computing applications, delivering the lowest possible inrush current, and highest level of safety.
Powerbox claims the industry’s first power supply for immerged computing applications, delivering the lowest possible inrush current, and highest level of safety.
Powerbox claims the industry’s first power supply for immerged computing applications, delivering the lowest possible inrush current, and highest level of safety.
Developed for data center applications, Allegro Microsystems claims the industry’s first three-phase BLDC driver with integrated power loss brake, which lowers BOM costs while improving thermal efficiency.
Powerbox claims the industry’s first power supply for immerged computing applications, delivering the lowest possible inrush current, and highest level of safety.
Developed for data center applications, Allegro Microsystems claims the industry’s first three-phase BLDC driver with integrated power loss brake, which lowers BOM costs while improving thermal efficiency.
Powerbox claims the industry’s first power supply for immerged computing applications, delivering the lowest possible inrush current, and highest level of safety.
Developed for data center applications, Allegro Microsystems claims the industry’s first three-phase BLDC driver with integrated power loss brake, which lowers BOM costs while improving thermal efficiency.
Bourns’ flyback power transformer delivers enhanced DC/DC power conversion efficiency in isolated mode, supporting IEEE 802.3 af-compliant, integrated PoE powered device, and PWM controller applications.
The ASi-5 ASSP offers easy fieldbus connectivity for sensors, actuators, and other industrial equipment, enabling faster transmission of larger data quantities and more efficient integration with smart sensors in industrial IoT applications.
TE’s zSFP+ stacked belly-to-belly connectors support data rates up to 28 Gbits/s NRZ and 56 Gbits/s PAM-4 for hyperscale data centers and network switch applications.
Bourns’ flyback power transformer delivers enhanced DC/DC power conversion efficiency in isolated mode, supporting IEEE 802.3 af-compliant, integrated PoE powered device, and PWM controller applications.
The ASi-5 ASSP offers easy fieldbus connectivity for sensors, actuators, and other industrial equipment, enabling faster transmission of larger data quantities and more efficient integration with smart sensors in industrial IoT applications.
TE’s zSFP+ stacked belly-to-belly connectors support data rates up to 28 Gbits/s NRZ and 56 Gbits/s PAM-4 for hyperscale data centers and network switch applications.
Advances in medical devices require improvements across component technologies, especially in sensor design, as consumers demand smarter and more secure connected devices and their appetite for wearables continues to grow.
Advances in medical devices require improvements across component technologies, especially in sensor design, as consumers demand smarter and more secure connected devices and their appetite for wearables continues to grow.
Chipmakers are developing MPUs and MCUs that tackle the biggest challenges in medical devices ranging from imaging equipment to fitness trackers.
Chipmakers are developing MPUs and MCUs that tackle the biggest challenges in medical devices ranging from imaging equipment to fitness trackers.
MEMS microphones are making inroads in the hearing aid market as performance improves and package sizes shrink.
MEMS microphones are making inroads in the hearing aid market as performance improves and package sizes shrink.
MEMS microphones are making inroads in the hearing aid market as performance improves and package sizes shrink.
Medical device designers are finally turning the corner with the IoT, thanks to advances in SoC designs that reduce power consumption, lower costs, and shrink device size.
Medical device designers are finally turning the corner with the IoT, thanks to advances in SoC designs that reduce power consumption, lower costs, and shrink device size.
Dialog Semiconductor claims the smallest and most energy-efficient Bluetooth 5.1 SoC, reducing size and cost of IoT devices and extending wireless connectivity to applications in the connected medical field.
The STTS22H temperature sensor from STMicroelectronics offers high accuracy with low operating and standby current and flexible operating modes.
Harwin introduces mixed-layout versions of its Gecko-SL series, delivering weight and space savings by combining power and signal contacts in one mating pair.
Bel Magnetic Solutions offers a series of press-fit ICMs that include single- and dual-port 1GBaseT modules.
The wedge-shaped SMART-CONTROL enclosure line is available in two versions and in two sizes.
Dialog Semiconductor claims the smallest and most energy-efficient Bluetooth 5.1 SoC, reducing size and cost of IoT devices and extending wireless connectivity to applications in the connected medical field.
The STTS22H temperature sensor from STMicroelectronics offers high accuracy with low operating and standby current and flexible operating modes.
Harwin introduces mixed-layout versions of its Gecko-SL series, delivering weight and space savings by combining power and signal contacts in one mating pair.
The wedge-shaped SMART-CONTROL enclosure line is available in two versions and in two sizes.
Bel Magnetic Solutions offers a series of press-fit ICMs that include single- and dual-port 1GBaseT modules.
The wedge-shaped SMART-CONTROL enclosure line is available in two versions and in two sizes.
Researchers at ICN2 and ICMM-CSIC have developed a 2D thermo-functional material for radiative cooling, which can cool surfaces without energy consumption or gas emissions.
Researchers at ICN2 and ICMM-CSIC have developed a 2D thermo-functional material for radiative cooling, which can cool surfaces without energy consumption or gas emissions.
Although Yageo’s acquisition of Kemet will result in $3-billion powerhouse in the IP&E market, designers need to be concerned about the potential for product lines that overlap, resulting in discontinued products, a problem for long-lifecycle equipment.
Although Yageo’s acquisition of Kemet will result in $3-billion powerhouse in the IP&E market, designers need to be concerned about the potential for product lines that overlap, resulting in discontinued products, a problem for long-lifecycle equipment.
Here is how accuracy, energy efficiency, and the availability of reference design solutions influence the selection and integration of sensors in medical and fitness wearables.
Here is how accuracy, energy efficiency, and the availability of reference design solutions influence the selection and integration of sensors in medical and fitness wearables.
TE Connectivity has expanded its 369 connector family with new EMI-shielded rectangular connectors for harsh military environments.
Infineon expands its CoolGaN family of e-mode HEMT power transistors with the addition of industrial-grade 400-V and 600-V devices.
TE Connectivity has expanded its 369 connector family with new EMI-shielded rectangular connectors for harsh military environments.
TE Connectivity has expanded its 369 connector family with new EMI-shielded rectangular connectors for harsh military environments.
Infineon expands its CoolGaN family of e-mode HEMT power transistors with the addition of industrial-grade 400-V and 600-V devices.
A new family of temperature sensors from ams combines high accuracy with ultra-low-power consumption in a tiny wafer-level chip-scale package (WLCSP).
Mini-Circuits and Vayyar offer a ready-to-use development kit that lets engineers and researchers develop 4D mmWave imaging and sensing applications.
Cadence claims its new system analysis tool, Celsius Thermal Solver, is the industry’s first complete electrical-thermal co-simulation solution for electronic systems from ICs to physical enclosures.
Mini-Circuits and Vayyar offer a ready-to-use development kit that lets engineers and researchers develop 4D mmWave imaging and sensing applications.
Cadence claims its new system analysis tool, Celsius Thermal Solver, is the industry’s first complete electrical-thermal co-simulation solution for electronic systems from ICs to physical enclosures.
This week’s top five are an eclectic group of products, including Ethernet cables, an all-in-one biosensor, a 5G mobile processor and modem, networking modules, and microcontrollers with Azure RTOS.
This week’s top five are an eclectic group of products, including Ethernet cables, an all-in-one biosensor, a 5G mobile processor and modem, networking modules, and microcontrollers with Azure RTOS.
Raltron expands its RF cable assembly portfolio to include several series of flexible low-loss coaxial cable assemblies.
RIGOL Technologies has expanded its line of 16-bit arbitrary function generators with a new series aimed at more rugged and industrial applications.
Murata’s 600-W eighth brick DC/DC converter meets the growing power requirements for networking and telecommunications infrastructure equipment.
Raltron expands its RF cable assembly portfolio to include several series of flexible low-loss coaxial cable assemblies.
RIGOL Technologies has expanded its line of 16-bit arbitrary function generators with a new series aimed at more rugged and industrial applications.
Raltron expands its RF cable assembly portfolio to include several series of flexible low-loss coaxial cable assemblies.
RIGOL Technologies has expanded its line of 16-bit arbitrary function generators with a new series aimed at more rugged and industrial applications.
Murata’s 600-W eighth brick DC/DC converter meets the growing power requirements for networking and telecommunications infrastructure equipment.
Achronix and BittWare deliver a high-bandwidth accelerator card with Achronix’s latest Speedster 7t FPGA, along with the card pre-integrated into fully-test FPGA servers.
Achronix and BittWare deliver a high-bandwidth accelerator card with Achronix’s latest Speedster 7t FPGA, along with the card pre-integrated into fully-test FPGA servers.
An efficient DC/DC or AC/DC power supply and a very low-power microcontroller to maximize battery life are the key elements for proper power management in medical diagnostic devices.
An efficient DC/DC or AC/DC power supply and a very low-power microcontroller to maximize battery life are the key elements for proper power management in medical diagnostic devices.
USB-C is supposed to be primarily a connectivity option, but it’s finding a home as power management in portable devices.
USB-C is supposed to be primarily a connectivity option, but it’s finding a home as power management in portable devices.
The ruggedized Raychem 10 Gbits/s Cat 7 cables operate in harsh military marine and defense applications.
IDT’s all-in-one biosensor module for wearables and mobile devices integrate heart rate and blood oxygen measurement, together with an ambient light sensor, RGB color sensor, proximity sensor, and pulse oximeter biosensor.
The ruggedized Raychem 10 Gbits/s Cat 7 cables operate in harsh military marine and defense applications.
IDT’s all-in-one biosensor module for wearables and mobile devices integrate heart rate and blood oxygen measurement, together with an ambient light sensor, RGB color sensor, proximity sensor, and pulse oximeter biosensor.
Simplifying IoT device development, Renesas expands the integration of Azure RTOS to its broader line of RA and RX microcontrollers and RZ/A microprocessor lines, including Azure IoT building blocks.
RS Components now offers a professional upgrade to its free DesignSpark PCB design tool as part of its online engineering community in North America.
Micron’s Authenta key management service platform offers the industry’s first silicon-based security-as-a-service platform for IoT edge devices.
Samsung announced its next-generation Exynos 990 mobile processor and Exynos Modem 5123 for 5G and artificial intelligence applications.
Simplifying IoT device development, Renesas expands the integration of Azure RTOS to its broader line of RA and RX microcontrollers and RZ/A microprocessor lines, including Azure IoT building blocks.
RS Components now offers a professional upgrade to its free DesignSpark PCB design tool as part of its online engineering community in North America.
Samsung announced its next-generation Exynos 990 mobile processor and Exynos Modem 5123 for 5G and artificial intelligence applications.
Micron’s Authenta key management service platform offers the industry’s first silicon-based security-as-a-service platform for IoT edge devices.
Samsung announced its next-generation Exynos 990 mobile processor and Exynos Modem 5123 for 5G and artificial intelligence applications.
Hybrid chips, combining silicon-based CMOS and compound semiconductor technologies, delivers the best of both worlds for fast 5G networks.
Hybrid chips, combining silicon-based CMOS and compound semiconductor technologies, delivers the best of both worlds for fast 5G networks.
Test and measurement topped last week’s hot products list with a new spectrum analyzer, motor drive analyzer, and arbitrary function generator, along with LPDDR4 ECC DRAMs and a new pre-provisioned hardware-based IoT security platform.
Test and measurement topped last week’s hot products list with a new spectrum analyzer, motor drive analyzer, and arbitrary function generator, along with LPDDR4 ECC DRAMs and a new pre-provisioned hardware-based IoT security platform.
Silicon Labs offers a series of highly integrated and pre-certified Zigbee, Thread, and Bluetooth mesh networking modules that simplify the development of IoT products, ranging from smart LED lighting to home and industrial IoT applications.
The automotive industry will become the largest market for 5G IoT solutions by 2023, and component manufacturers are already rolling out innovative products to help designers implement the next-generation technology.
Analog Devices’ software-configurable analog front-end (AFE) with integrated ADC enables platform designs for lower cost and faster time to market, and makes them suitable for Industry 4.0 implementations.
Maxim’s battery monitor IC offers designers a single-chip solution for ASIL-D compliance in automotive applications for mid-to-large cell count configurations, while helping reduce BOM costs and development time.
Vishay’s automotive-grade IHLP inductors offer operating temperatures as high as 155°C for under-the-hood applications.
Bourns released a miniature resettable thermal-cutoff (TCO) device series that is designed for smaller smartphones and portable electronics batteries.
The u-blox UBX-M9140 chip and the NEO-M9N module can receive signals from up to four GNSS constellations — GPS, Glonass, Beidou, and Galileo — concurrently, to achieve high positional accuracy.
Analog Devices’ software-configurable analog front-end (AFE) with integrated ADC enables platform designs for lower cost and faster time to market, and makes them suitable for Industry 4.0 implementations.
Maxim’s battery monitor IC offers designers a single-chip solution for ASIL-D compliance in automotive applications for mid-to-large cell count configurations, while helping reduce BOM costs and development time.
Vishay’s automotive-grade IHLP inductors offer operating temperatures as high as 155°C for under-the-hood applications.
Bourns released a miniature resettable thermal-cutoff (TCO) device series that is designed for smaller smartphones and portable electronics batteries.
Last week’s hot products ranged from power management devices and microcontrollers with advanced security for IoT to barrier-breaking GHz microcontrollers and low-power image sensors.
Analog Devices has released a suite of hardware measurement kits and software tools for precision measurement in a variety of applications including agriculture, machine health monitoring, and electrochemistry.
Aimed at all-sized companies as well as hobbyists, STMicroelectronics released $99 development packs that offer a complete LoRaWAN development chain from boards to firmware and tools.
Analog Devices has released a suite of hardware measurement kits and software tools for precision measurement in a variety of applications including agriculture, machine health monitoring, and electrochemistry.
Aimed at all-sized companies as well as hobbyists, STMicroelectronics released $99 development packs that offer a complete LoRaWAN development chain from boards to firmware and tools.
UltraSoC unveils hardware-based embedded real-time monitoring intellectual property (IP) modules aimed at detecting, blocking and recording cyber-attacks.
Intelligent Memory unveils LPDDR4 and LPDDR4X DRAMs with integrated ECC error-correction capabilities that operate over the industrial temperature range.
Intelligent Memory unveils LPDDR4 and LPDDR4X DRAMs with integrated ECC error-correction capabilities that operate over the industrial temperature range.
RIGOL rolls out a new lower cost real-time spectrum analyzer with advanced analysis capability for embedded RF IoT designs and EMI pre-compliance testing.
RIGOL rolls out a new lower cost real-time spectrum analyzer with advanced analysis capability for embedded RF IoT designs and EMI pre-compliance testing.
Teledyne LeCroy’s next-generation motor drive analyzers offer higher channel counts, memory, sample rates, and bandwidth.
Microchip’s pre-provisioned hardware-based IoT security platform, based on its CryptoAuthentication family of security ICs, provides secure key storage for all sizes of deployments.
Microchip’s pre-provisioned hardware-based IoT security platform, based on its CryptoAuthentication family of security ICs, provides secure key storage for all sizes of deployments.
NXP’s new AI toolkit, eIQ Auto, is designed to make it easier for autonomous vehicle (AV) designers to implement deep learning in vehicles.
NXP’s new AI toolkit, eIQ Auto, is designed to make it easier for autonomous vehicle (AV) designers to implement deep learning in vehicles.
This design solution shows how an efficient voltage regulator boost converter with low shutdown and low quiescent current helps a smart-factory indoor BLE beacon last two years on a single battery.
This design solution shows how an efficient voltage regulator boost converter with low shutdown and low quiescent current helps a smart-factory indoor BLE beacon last two years on a single battery.
Tektronix released a new double pulse test software plugin for its AFG31000 arbitrary function generator that delivers double pulse testing in less than a minute.
Renesas unveiled the RA family of MCUs with advanced security and performance, together with a software and hardware partner ecosystem for embedded IoT.
Tektronix released a new double pulse test software plugin for its AFG31000 arbitrary function generator that delivers double pulse testing in less than a minute.
Tektronix released a new double pulse test software plugin for its AFG31000 arbitrary function generator that delivers double pulse testing in less than a minute.
Renesas unveiled the RA family of MCUs with advanced security and performance, together with a software and hardware partner ecosystem for embedded IoT.
Last week’s hot products ranged from dev kits for microLED displays and tiny digital IR proximity sensing for wireless earbuds to microcontrollers for embedded and industrial applications and semiconductor system testers.
Last week’s hot products ranged from dev kits for microLED displays and tiny digital IR proximity sensing for wireless earbuds to microcontrollers for embedded and industrial applications and semiconductor system testers.
Renesas claims the automotive industry’s first full HD LCD video controller with MIPI-CSI2 input, and collaborates with StradVision to develop a deep learning-based object recognition solution.
ON Semiconductor’s 0.3-MP image sensors delivers high-performance image capture, even in low-light conditions, while consuming minimal power.
Organic LCDs (OLCDs) can be manufactured on plastic substrates, offering the ability to be curved around a tight radius or cut to unusual shapes, with the additional benefits of being ultra-thin, shatterproof, and lightweight.
The NXP i.MX RT1170 family of ‘crossover’ MCUs run up to 1 GHz while maintaining low-power efficiency for industrial, IoT, and automotive applications.
The NXP i.MX RT1170 family of ‘crossover’ MCUs run up to 1 GHz while maintaining low-power efficiency for industrial, IoT, and automotive applications.
The latest sub-PMIC family sports a 4-MHz switching frequency that enables the use of smaller external components, supports a single output up to 6/10 A or dual outputs up to 3/5 A per output, and runs from a single-cell Li-ion battery or 3.3-V or 5-V power supplies.
The latest sub-PMIC family sports a 4-MHz switching frequency that enables the use of smaller external components, supports a single output up to 6/10 A or dual outputs up to 3/5 A per output, and runs from a single-cell Li-ion battery or 3.3-V or 5-V power supplies.
The MEMS & Imaging Sensors Summit showcased several hot product trends, ranging from smart sensors and event-based vision sensors to cloud simulation for MEMS development and audio architectures for new voice control devices.
The MEMS & Imaging Sensors Summit showcased several hot product trends, ranging from smart sensors and event-based vision sensors to cloud simulation for MEMS development and audio architectures for new voice control devices.
ADI’s digital audio bus technology and new audio processors offer size, weight and power advantages, while reducing system complexity and improving sound quality in automobiles.
ADI’s digital audio bus technology and new audio processors offer size, weight and power advantages, while reducing system complexity and improving sound quality in automobiles.
The combination of smart manufacturing with edge AI delivers several benefits, including real-time decision-making, lower costs, operational reliability, and enhanced safety.
The combination of smart manufacturing with edge AI delivers several benefits, including real-time decision-making, lower costs, operational reliability, and enhanced safety.
Plessey offers a starter development kit, based on its GaN-on-Silicon technology, for small form-factor microLED designs.
Plessey offers a starter development kit, based on its GaN-on-Silicon technology, for small form-factor microLED designs.
A partnership between Atmosic Technologies and Matrix Industries promises to deliver battery-free industrial IoT devices, leveraging the companies’ ultra-low-power and thermoelectric energy harvesting technologies, respectively.
A partnership between Atmosic Technologies and Matrix Industries promises to deliver battery-free industrial IoT devices, leveraging the companies’ ultra-low-power and thermoelectric energy harvesting technologies, respectively.
Ams claims the industry’s smallest digital IR proximity sensing module, which occupies only 1 mm3 of volume, making it suited for wireless stereo earbud products.
Ams claims the industry’s smallest digital IR proximity sensing module, which occupies only 1 mm3 of volume, making it suited for wireless stereo earbud products.
The 8-pin STM32GO microcontrollers from STMicroelectronics leverages the performance and power efficiency of the 32-bit STM32 family in a small package for simple embedded designs.
The NI semiconductor test system software enhancements reduce production test costs, while improving test efficiency.
The NI semiconductor test system software enhancements reduce production test costs, while improving test efficiency.
The goal to create industrial networks that are fully interoperable, completely secure, and cloud connected while communicating in real time poses some major challenges for Industry 4.0.
The goal to create industrial networks that are fully interoperable, completely secure, and cloud connected while communicating in real time poses some major challenges for Industry 4.0.
Dialog’s new family of configurable sub-PMICs reduce solution size by up to 40% and cut requirements for external components by more than half for mobile applications.
The R&S RTP oscilloscope family adds 13-GHz and 16-GHz models, together with new debugging functions including a high-speed serial pattern trigger, and TDR and TDT analysis.
Dialog’s new family of configurable sub-PMICs reduce solution size by up to 40% and cut requirements for external components by more than half for mobile applications.
The R&S RTP oscilloscope family adds 13-GHz and 16-GHz models, together with new debugging functions including a high-speed serial pattern trigger, and TDR and TDT analysis.
Power components for industrial equipment must meet high-performance requirements, ranging from higher energy efficiency to robust operation in harsh environments.
Power components for industrial equipment must meet high-performance requirements, ranging from higher energy efficiency to robust operation in harsh environments.
TI’s TPS7A02 ultra-low-power LDO linear voltage regulator claims the industry’s lowest quiescent current of sub-25 nA, and doubles the battery life for applications using standard battery chemistries.
TI’s TPS7A02 ultra-low-power LDO linear voltage regulator claims the industry’s lowest quiescent current of sub-25 nA, and doubles the battery life for applications using standard battery chemistries.
Last week’s hot products ranged from enclosures and AI chips to power and battery management ICs.
Last week’s hot products ranged from enclosures and AI chips to power and battery management ICs.
STMicroelectronics offers digital-power and motor-control discovery kits for its STM32G4 microcontrollers, targeting applications such as race drones, prosumer drones, and small electric vehicles.
Renesas unveils the RX72M industrial Ethernet MCU solution that includes an evaluation board, operating system, middleware, and sample software, supporting about 70% of the protocols used in industrial network applications.
Renesas unveils the RX72M industrial Ethernet MCU solution that includes an evaluation board, operating system, middleware, and sample software, supporting about 70% of the protocols used in industrial network applications.
STMicroelectronics offers digital-power and motor-control discovery kits for its STM32G4 microcontrollers, targeting applications such as race drones, prosumer drones, and small electric vehicles.
Renesas unveils the RX72M industrial Ethernet MCU solution that includes an evaluation board, operating system, middleware, and sample software, supporting about 70% of the protocols used in industrial network applications.
TI’s three-in-one switching boost converter delivers the industry’s lowest quiescent current, increasing battery capacity and life in small medical and personal electronics devices.
At IFA 2019, Huawei, Qualcomm and Samsung rolled out their new mobile processor platforms with integrated 5G modems.
