The Picotest two-way wideband active splitter adds the power integrity verification measurement to oscilloscopes, traditionally only available on VNAs or FRAs.
Lextar offers a new series of miniLED smart backlight modules that integrate miniLEDs and the driver IC for a high contrast and slim design.
Lextar offers a new series of miniLED smart backlight modules that integrate miniLEDs and the driver IC for a high contrast and slim design.
The Picotest two-way wideband active splitter adds the power integrity verification measurement to oscilloscopes, traditionally only available on VNAs or FRAs.
Lextar offers a new series of miniLED smart backlight modules that integrate miniLEDs and the driver IC for a high contrast and slim design.
TE Connectivity offers the LGA 4189 socket with related hardware products for Intel’s next-generation processors that support PCIe Gen 4, and four or eight multi-processor system architectures.
Microchip expands its USB Type-C portfolio with a certified USB 3.1 PD SmartHub IC and standalone USB Type-C PD controller.
TE Connectivity offers the LGA 4189 socket with related hardware products for Intel’s next-generation processors that support PCIe Gen 4, and four or eight multi-processor system architectures.
Microchip expands its USB Type-C portfolio with a certified USB 3.1 PD SmartHub IC and standalone USB Type-C PD controller.
TE Connectivity offers the LGA 4189 socket with related hardware products for Intel’s next-generation processors that support PCIe Gen 4, and four or eight multi-processor system architectures.
The factory of the future is no longer a pipe dream, with industrial IoT and AI solutions creating a renaissance on the manufacturing floor.
Senseg creates a new category of flexible electronics with the launch of the industry’s first flexible actuators manufactured on roll-to-roll technology, delivering benefits in scalability, size, weight, and cost.
Senseg creates a new category of flexible electronics with the launch of the industry’s first flexible actuators manufactured on roll-to-roll technology, delivering benefits in scalability, size, weight, and cost.
Senseg creates a new category of flexible electronics with the launch of the industry’s first flexible actuators manufactured on roll-to-roll technology, delivering benefits in scalability, size, weight, and cost.
Machine learning and neural network processing took center stage at this year’s Hot Chips event with two different approaches to AI chips emerging.
Machine learning and neural network processing took center stage at this year’s Hot Chips event with two different approaches to AI chips emerging.
Buck switchers with low standby current and high efficiency target low-power applications, and are particularly suited for small appliances and IoT endpoints.
Intel shared more details about its upcoming Nervana neural network processors for AI training and inference.
The Virtex UltraScale+ VU19P features 35 billion transistors, delivering the industry’s highest logic density and I/O count on a single chip.
The Virtex UltraScale+ VU19P features 35 billion transistors, delivering the industry’s highest logic density and I/O count on a single chip.
The Virtex UltraScale+ VU19P features 35 billion transistors, delivering the industry’s highest logic density and I/O count on a single chip.
The Renesas RX65N Cloud Kit features a 32-bit RX65N MCU with Amazon FreeRTOS, Wi-Fi, and three sensors that connects to the AWS cloud.
Looking at heat in electronic devices in a new way, Stanford researchers have developed a heat shield that is roughly 50,000× thinner than a sheet of paper.
Looking at heat in electronic devices in a new way, Stanford researchers have developed a heat shield that is roughly 50,000× thinner than a sheet of paper.
The Renesas RX65N Cloud Kit features a 32-bit RX65N MCU with Amazon FreeRTOS, Wi-Fi, and three sensors that connects to the AWS cloud.
Looking at heat in electronic devices in a new way, Stanford researchers have developed a heat shield that is roughly 50,000× thinner than a sheet of paper.
Balluff’s configurator tool simplifies the selection and configuration of a complete machine vision system.
Balluff’s configurator tool simplifies the selection and configuration of a complete machine vision system.
Innodisk launches a new hybrid edge and cloud SSD with native Microsoft Azure Sphere integration.
Innodisk launches a new hybrid edge and cloud SSD with native Microsoft Azure Sphere integration.
The high-current power inductors address the need for increased power conversion and filtering requirements in the transportation market.
Semiconductor advances are addressing key challenges in the design of ultrasound smart probes, enabling smaller and lower power consumption handheld devices.
The high-current power inductors address the need for increased power conversion and filtering requirements in the transportation market.
Semiconductor advances are addressing key challenges in the design of ultrasound smart probes, enabling smaller and lower power consumption handheld devices.
Harwin introduces fully tested off-the-shelf cable assemblies for its series of Datamate high-reliability connectors.
Samsung, in partnership with Xiaomi Corp., has claimed the first mobile image sensor with more than 100-million pixels, bringing the resolution of a high-end DSLR camera to smartphones.
The mCube demo board features two tiny and ultra-low-power three-axis MEMS motion sensors that demostrates various use cases for accelerometers such as activity tracking and power management.
Harwin introduces fully tested off-the-shelf cable assemblies for its series of Datamate high-reliability connectors.
Samsung, in partnership with Xiaomi Corp., has claimed the first mobile image sensor with more than 100-million pixels, bringing the resolution of a high-end DSLR camera to smartphones.
The mCube demo board features two tiny and ultra-low-power three-axis MEMS motion sensors that demostrates various use cases for accelerometers such as activity tracking and power management.
Infineon’s constant current flyback controller with a high power factor and primary-side regulation provides built-in features that enable fast design cycles.
Infineon’s constant current flyback controller with a high power factor and primary-side regulation provides built-in features that enable fast design cycles.
Here’s a selection of 10 resistors designed for harsh environments, including automotive and industrial applications.
Here’s a selection of 10 resistors designed for harsh environments, including automotive and industrial applications.
Microchip’s serial memory controller for data centers delivers the high memory bandwidth needed by CPUs and SoCs for AI and machine learning.
RIGOL’s 2-GHz oscilloscope with new jitter and real-time eye analysis options delivers an affordable scope for embedded designs.
TE Connectivity expands its ELCON Micro wire-to-board product family with custom cable assemblies and a cable plug solution.
Würth’s LAN transformers target industrial Ethernet interfaces with improved crosstalk and return loss.
Microchip’s serial memory controller for data centers delivers the high memory bandwidth needed by CPUs and SoCs for AI and machine learning.
The plug-and-play storage chips allow IoT designers to bypass the need to source, program and serialize MAC addresses for connected devices.
Connected cardiac monitoring systems for the IoMT will require highly complex analog front-ends, high-performance MCUs, and low-power wireless connectivity, coupled with complex algorithms, and AI engines.
The plug-and-play storage chips allow IoT designers to bypass the need to source, program and serialize MAC addresses for connected devices.
First reviews of Intel’s 10-nm code-named Ice Lake processors praise the boost in onboard graphics, while indicating disappointment in CPU improvements.
First reviews of Intel’s 10-nm code-named Ice Lake processors praise the boost in onboard graphics, while indicating disappointment in CPU improvements.
Here’s a selection of online component configuration tools, from power supplies to cable assemblies, that help designers configure parts that precisely match their applications requirements.
Here’s a selection of online component configuration tools, from power supplies to cable assemblies, that help designers configure parts that precisely match their applications requirements.
Microchip’s new analog embedded memory, memBrain, significantly reduces compute power to improve AI inference at the edge for a variety of applications, from automotive and industrial to consumer electronics.
Dialog’s first automotive-grade CMIC is easily customized, and reduces board space, bill of materials, and cost.
Dialog’s first automotive-grade CMIC is easily customized, and reduces board space, bill of materials, and cost.
CEVA’s audio/voice DSPs now work with DSP Concepts’ Audio Weaver and TalkTo software tools to streamline the development of advanced audio applications for voice-enabled devices.
CEVA’s audio/voice DSPs now work with DSP Concepts’ Audio Weaver and TalkTo software tools to streamline the development of advanced audio applications for voice-enabled devices.
CEVA’s audio/voice DSPs now work with DSP Concepts’ Audio Weaver and TalkTo software tools to streamline the development of advanced audio applications for voice-enabled devices.
