Intertek launched its Cyber Assured cybersecurity product testing and certification program that provides continuous vulnerability monitoring for connected consumer products.
Intertek launched its Cyber Assured cybersecurity product testing and certification program that provides continuous vulnerability monitoring for connected consumer products.
Intertek launched its Cyber Assured cybersecurity product testing and certification program that provides continuous vulnerability monitoring for connected consumer products.
Intertek launched its Cyber Assured cybersecurity product testing and certification program that provides continuous vulnerability monitoring for connected consumer products.
Soitec and Applied Materials have formed a joint development program to develop next-generation silicon carbide (SiC) substrates for power devices used in electric vehicles, telecommunications, and industrial applications.
Soitec and Applied Materials have formed a joint development program to develop next-generation silicon carbide (SiC) substrates for power devices used in electric vehicles, telecommunications, and industrial applications.
MediaTek claims the industry’s most advanced 5G chipset family with the launch of its Dimensity lineup, starting with the Dimensity 1000 5G mobile SoC.
A new analyze-first approach to voice wakeup device architecture uses 10x less power than a digitize-first-based approach to always-on listening, and uses localized intelligence to select and send only the relevant data to the cloud.
MediaTek claims the industry’s most advanced 5G chipset family with the launch of its Dimensity lineup, starting with the Dimensity 1000 5G mobile SoC.
MediaTek claims the industry’s most advanced 5G chipset family with the launch of its Dimensity lineup, starting with the Dimensity 1000 5G mobile SoC.
A new analyze-first approach to voice wakeup device architecture uses 10x less power than a digitize-first-based approach to always-on listening, and uses localized intelligence to select and send only the relevant data to the cloud.
Nvidia released a new reference design platform with hardware and software building blocks that enables designers to use Nvidia GPUs with Arm-based processors in high performance computing.
Nvidia released a new reference design platform with hardware and software building blocks that enables designers to use Nvidia GPUs with Arm-based processors in high performance computing.
Powerbox claims the industry’s first power supply for immerged computing applications, delivering the lowest possible inrush current, and highest level of safety.
Powerbox claims the industry’s first power supply for immerged computing applications, delivering the lowest possible inrush current, and highest level of safety.
Powerbox claims the industry’s first power supply for immerged computing applications, delivering the lowest possible inrush current, and highest level of safety.
Developed for data center applications, Allegro Microsystems claims the industry’s first three-phase BLDC driver with integrated power loss brake, which lowers BOM costs while improving thermal efficiency.
Powerbox claims the industry’s first power supply for immerged computing applications, delivering the lowest possible inrush current, and highest level of safety.
Developed for data center applications, Allegro Microsystems claims the industry’s first three-phase BLDC driver with integrated power loss brake, which lowers BOM costs while improving thermal efficiency.
Powerbox claims the industry’s first power supply for immerged computing applications, delivering the lowest possible inrush current, and highest level of safety.
Developed for data center applications, Allegro Microsystems claims the industry’s first three-phase BLDC driver with integrated power loss brake, which lowers BOM costs while improving thermal efficiency.
Bourns’ flyback power transformer delivers enhanced DC/DC power conversion efficiency in isolated mode, supporting IEEE 802.3 af-compliant, integrated PoE powered device, and PWM controller applications.
The ASi-5 ASSP offers easy fieldbus connectivity for sensors, actuators, and other industrial equipment, enabling faster transmission of larger data quantities and more efficient integration with smart sensors in industrial IoT applications.
TE’s zSFP+ stacked belly-to-belly connectors support data rates up to 28 Gbits/s NRZ and 56 Gbits/s PAM-4 for hyperscale data centers and network switch applications.
Bourns’ flyback power transformer delivers enhanced DC/DC power conversion efficiency in isolated mode, supporting IEEE 802.3 af-compliant, integrated PoE powered device, and PWM controller applications.
The ASi-5 ASSP offers easy fieldbus connectivity for sensors, actuators, and other industrial equipment, enabling faster transmission of larger data quantities and more efficient integration with smart sensors in industrial IoT applications.
TE’s zSFP+ stacked belly-to-belly connectors support data rates up to 28 Gbits/s NRZ and 56 Gbits/s PAM-4 for hyperscale data centers and network switch applications.
Advances in medical devices require improvements across component technologies, especially in sensor design, as consumers demand smarter and more secure connected devices and their appetite for wearables continues to grow.
Advances in medical devices require improvements across component technologies, especially in sensor design, as consumers demand smarter and more secure connected devices and their appetite for wearables continues to grow.
Chipmakers are developing MPUs and MCUs that tackle the biggest challenges in medical devices ranging from imaging equipment to fitness trackers.
Chipmakers are developing MPUs and MCUs that tackle the biggest challenges in medical devices ranging from imaging equipment to fitness trackers.
MEMS microphones are making inroads in the hearing aid market as performance improves and package sizes shrink.
MEMS microphones are making inroads in the hearing aid market as performance improves and package sizes shrink.
MEMS microphones are making inroads in the hearing aid market as performance improves and package sizes shrink.
Medical device designers are finally turning the corner with the IoT, thanks to advances in SoC designs that reduce power consumption, lower costs, and shrink device size.
Medical device designers are finally turning the corner with the IoT, thanks to advances in SoC designs that reduce power consumption, lower costs, and shrink device size.
Dialog Semiconductor claims the smallest and most energy-efficient Bluetooth 5.1 SoC, reducing size and cost of IoT devices and extending wireless connectivity to applications in the connected medical field.
The STTS22H temperature sensor from STMicroelectronics offers high accuracy with low operating and standby current and flexible operating modes.
Harwin introduces mixed-layout versions of its Gecko-SL series, delivering weight and space savings by combining power and signal contacts in one mating pair.
Bel Magnetic Solutions offers a series of press-fit ICMs that include single- and dual-port 1GBaseT modules.
The wedge-shaped SMART-CONTROL enclosure line is available in two versions and in two sizes.
Dialog Semiconductor claims the smallest and most energy-efficient Bluetooth 5.1 SoC, reducing size and cost of IoT devices and extending wireless connectivity to applications in the connected medical field.
The STTS22H temperature sensor from STMicroelectronics offers high accuracy with low operating and standby current and flexible operating modes.
Harwin introduces mixed-layout versions of its Gecko-SL series, delivering weight and space savings by combining power and signal contacts in one mating pair.
The wedge-shaped SMART-CONTROL enclosure line is available in two versions and in two sizes.
Bel Magnetic Solutions offers a series of press-fit ICMs that include single- and dual-port 1GBaseT modules.
The wedge-shaped SMART-CONTROL enclosure line is available in two versions and in two sizes.
Researchers at ICN2 and ICMM-CSIC have developed a 2D thermo-functional material for radiative cooling, which can cool surfaces without energy consumption or gas emissions.
Researchers at ICN2 and ICMM-CSIC have developed a 2D thermo-functional material for radiative cooling, which can cool surfaces without energy consumption or gas emissions.
Although Yageo’s acquisition of Kemet will result in $3-billion powerhouse in the IP&E market, designers need to be concerned about the potential for product lines that overlap, resulting in discontinued products, a problem for long-lifecycle equipment.
Although Yageo’s acquisition of Kemet will result in $3-billion powerhouse in the IP&E market, designers need to be concerned about the potential for product lines that overlap, resulting in discontinued products, a problem for long-lifecycle equipment.
Here is how accuracy, energy efficiency, and the availability of reference design solutions influence the selection and integration of sensors in medical and fitness wearables.
Here is how accuracy, energy efficiency, and the availability of reference design solutions influence the selection and integration of sensors in medical and fitness wearables.
TE Connectivity has expanded its 369 connector family with new EMI-shielded rectangular connectors for harsh military environments.
Infineon expands its CoolGaN family of e-mode HEMT power transistors with the addition of industrial-grade 400-V and 600-V devices.
TE Connectivity has expanded its 369 connector family with new EMI-shielded rectangular connectors for harsh military environments.
TE Connectivity has expanded its 369 connector family with new EMI-shielded rectangular connectors for harsh military environments.
Infineon expands its CoolGaN family of e-mode HEMT power transistors with the addition of industrial-grade 400-V and 600-V devices.
A new family of temperature sensors from ams combines high accuracy with ultra-low-power consumption in a tiny wafer-level chip-scale package (WLCSP).
Mini-Circuits and Vayyar offer a ready-to-use development kit that lets engineers and researchers develop 4D mmWave imaging and sensing applications.
Cadence claims its new system analysis tool, Celsius Thermal Solver, is the industry’s first complete electrical-thermal co-simulation solution for electronic systems from ICs to physical enclosures.
Mini-Circuits and Vayyar offer a ready-to-use development kit that lets engineers and researchers develop 4D mmWave imaging and sensing applications.
Cadence claims its new system analysis tool, Celsius Thermal Solver, is the industry’s first complete electrical-thermal co-simulation solution for electronic systems from ICs to physical enclosures.
This week’s top five are an eclectic group of products, including Ethernet cables, an all-in-one biosensor, a 5G mobile processor and modem, networking modules, and microcontrollers with Azure RTOS.
This week’s top five are an eclectic group of products, including Ethernet cables, an all-in-one biosensor, a 5G mobile processor and modem, networking modules, and microcontrollers with Azure RTOS.
Raltron expands its RF cable assembly portfolio to include several series of flexible low-loss coaxial cable assemblies.
RIGOL Technologies has expanded its line of 16-bit arbitrary function generators with a new series aimed at more rugged and industrial applications.
Murata’s 600-W eighth brick DC/DC converter meets the growing power requirements for networking and telecommunications infrastructure equipment.
Raltron expands its RF cable assembly portfolio to include several series of flexible low-loss coaxial cable assemblies.
RIGOL Technologies has expanded its line of 16-bit arbitrary function generators with a new series aimed at more rugged and industrial applications.
Raltron expands its RF cable assembly portfolio to include several series of flexible low-loss coaxial cable assemblies.
RIGOL Technologies has expanded its line of 16-bit arbitrary function generators with a new series aimed at more rugged and industrial applications.
Murata’s 600-W eighth brick DC/DC converter meets the growing power requirements for networking and telecommunications infrastructure equipment.
Achronix and BittWare deliver a high-bandwidth accelerator card with Achronix’s latest Speedster 7t FPGA, along with the card pre-integrated into fully-test FPGA servers.
Achronix and BittWare deliver a high-bandwidth accelerator card with Achronix’s latest Speedster 7t FPGA, along with the card pre-integrated into fully-test FPGA servers.
An efficient DC/DC or AC/DC power supply and a very low-power microcontroller to maximize battery life are the key elements for proper power management in medical diagnostic devices.
An efficient DC/DC or AC/DC power supply and a very low-power microcontroller to maximize battery life are the key elements for proper power management in medical diagnostic devices.
