Electronic Products announces winners of the 2019 Product of the Year Awards

Here are this year’s winners, selected by the editors of Electronic Products.

source http://www.electronicproducts.com/News/Electronic_Products_announces_winners_of_the_2019_Product_of_the_Year_Awards.aspx

Electronic Products announces winners of the 2019 Product of the Year Awards

Here are this year’s winners, selected by the editors of Electronic Products.

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EP announces 24 finalists for the 2019 Product of the Year Awards

Electronic Products has announced the finalists for the 2019 Product of the Year Awards, now in its 44^th year.

source http://www.electronicproducts.com/News/EP_announces_24_finalists_for_the_2019_Product_of_the_Year_Awards.aspx

EP announces 24 finalists for the 2019 Product of the Year Awards

Electronic Products has announced the finalists for the 2019 Product of the Year Awards, now in its 44^th year.

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Panasonic launches two U-type NiMH cells

Panasonic’s new U-type NiMH battery cells offer high temperature tolerance up to 75°C and long life up to 10 years.

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TDK claims first flip-type 0510 MLCC

TDK is claiming the first flip-type MLCC in a 0510 package for automotive applications.

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Panasonic launches two U-type NiMH cells

Panasonic’s new U-type NiMH battery cells offer high temperature tolerance up to 75°C and long life up to 10 years.

source http://www.electronicproducts.com/Power_Products/Batteries_and_Fuel_Cells/Panasonic_launches_two_U_type_NiMH_cells.aspx

TDK claims first flip-type 0510 MLCC

TDK is claiming the first flip-type MLCC in a 0510 package for automotive applications.

source http://www.electronicproducts.com/Passive_Components/Capacitors/TDK_claims_first_flip_type_0510_MLCC.aspx

Robotic design: the recipe for commercial success in 2020

Bigger SoCs, smarter sensors, and AI capabilities define design imperatives for mass-scale robot deployments.

source http://www.electronicproducts.com/Robotics/Robotic_design_the_recipe_for_commercial_success_in_2020.aspx

Robotic design: the recipe for commercial success in 2020

Bigger SoCs, smarter sensors, and AI capabilities define design imperatives for mass-scale robot deployments.

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AC/DC power supplies improve efficiency, cut component count

Increased demand for robustness, reliability, and efficiency has resulted in the development of innovative technologies and highly integrated AC/DC power devices that reduce heat dissipation, switching losses, and component count.

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AC/DC power supplies improve efficiency, cut component count

Increased demand for robustness, reliability, and efficiency has resulted in the development of innovative technologies and highly integrated AC/DC power devices that reduce heat dissipation, switching losses, and component count.

source http://www.electronicproducts.com/Power_Products/AC_DC_Power_Supplies/AC_DC_power_supplies_improve_efficiency_cut_component_count.aspx

Pre-wired spring-loaded connectors save installation time

The Mill-Max pre-wired connectors combine spring-loaded pins with a 12” pig-tail, offering a convenient cable assembly system for a variety of applications.

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Flex improves power designer tool

Flex Power Modules has released a new version of its Flex Power Designer software with new calculation features that makes it easier and faster to design digital power systems.

 

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Design considerations for high-resolution systems

By carefully looking at the PGAs, op amps, INAs and other analog front-end components and their process technologies, designers can select the best devices for their high-resolution system designs.

 

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Kemet’s CTO talks virtual reality

Kemet’s deep dive into haptic actuator technologies for VR and wearables began with its collaboration, and subsequent acquisition, of Novasentis.

source http://www.electronicproducts.com/News/Kemet_s_CTO_talks_virtual_reality.aspx

Kemet’s CTO talks virtual reality

Kemet’s deep dive into haptic actuator technologies for VR and wearables began with its collaboration, and subsequent acquisition, of Novasentis.

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SPEC 55 LF wire and cable offers 5× ruggedness in space

TE Connectivity has released its SPEC 55 LF wire and cable insulation system that exceeds MIL-SPEC standards for outgassing and scrap abrasion, offering 5× ruggedness in space applications.

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SPEC 55 LF wire and cable offers 5× ruggedness in space

TE Connectivity has released its SPEC 55 LF wire and cable insulation system that exceeds MIL-SPEC standards for outgassing and scrap abrasion, offering 5× ruggedness in space applications.

source http://www.electronicproducts.com/Interconnections/Wire_and_Cable/SPEC_55_LF_wire_and_cable_offers_5_ruggedness_in_space.aspx

Automotive LED slims headlight designs

Osram’s Oslon Boost HM LED delivers high brightness in a compact footprint for automotive headlights.

source http://www.electronicproducts.com/Optoelectronics/LEDs/Automotive_LED_slims_headlight_designs.aspx

SPEC 55 LF wire and cable offers 5x ruggedness in space

TE Connectivity has released its SPEC 55 LF wire and cable insulation system that exceeds MIL-SPEC standards for outgassing and scrap abrasion, offering 5x ruggedness in space applications.

source http://www.electronicproducts.com/Interconnections/Wire_and_Cable/SPEC_55_LF_wire_and_cable_offers_5x_ruggedness_in_space.aspx

Multicoax connector simplifies board layout

Amphenol Ardent Concepts adds a 16-channel, right-angle form factor to its TR Multicoax connector portfolio to alleviate height concerns with its vertical launch connectors.

source http://www.electronicproducts.com/Interconnections/Connectors/Multicoax_connector_simplifies_board_layout.aspx

Automotive LED slims headlight designs

Osram’s Oslon Boost HM LED delivers high brightness in a compact footprint for automotive headlights.

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SPEC 55 LF wire and cable offers 5x ruggedness in space

TE Connectivity has released its SPEC 55 LF wire and cable insulation system that exceeds MIL-SPEC standards for outgassing and scrap abrasion, offering 5x ruggedness in space applications.

from Electronic Products Technology Center Articles https://ift.tt/38yTR5L

Multicoax connector simplifies board layout

Amphenol Ardent Concepts adds a 16-channel, right-angle form factor to its TR Multicoax connector portfolio to alleviate height concerns with its vertical launch connectors.

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Stewart Connector adds USB Type-C connector

Stewart Connector now offers USB Type-C right-angle receptacles for use in consumer devices.

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Automotive LED slims headlight designs

Osram’s Oslon Boost HM LED delivers high brightness in a compact footprint for automotive headlights.

source http://www.electronicproducts.com/Templates/Default.aspx?id=123516

SPEC 55 LF wire and cable offers 5x ruggedness in space

TE Connectivity has released its SPEC 55 LF wire and cable insulation system that exceeds MIL-SPEC standards for outgassing and scrap abrasion, offering 5x ruggedness in space applications.

source http://www.electronicproducts.com/Templates/Default.aspx?id=123514

Multicoax connector simplifies board layout

Amphenol Ardent Concepts adds a 16-channel, right-angle form factor to its TR Multicoax connector portfolio to alleviate height concerns with its vertical launch connectors.

source http://www.electronicproducts.com/Templates/Default.aspx?id=123512

Stewart Connector adds USB Type-C connector

Stewart Connector now offers USB Type-C right-angle receptacles for use in consumer devices.

source http://www.electronicproducts.com/Interconnections/Connectors/Stewart_Connector_adds_USB_Type_C_connector.aspx

TDK updates Magnetic Design Tool

TDK enhances the functionality of its Magnetic Design Tool to enable fast calculation and graphical representation of parameters for EPCOS ferrite materials.

source http://www.electronicproducts.com/Passive_Components/Magnetics_Inductors_Transformers/TDK_updates_Magnetic_Design_Tool.aspx

TDK updates Magnetic Design Tool

TDK enhances the functionality of its Magnetic Design Tool to enable fast calculation and graphical representation of parameters for EPCOS ferrite materials.

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TDK updates magnetic design tool

TDK enhances the functionality of its magnetic design tool to enable fast calculation and graphical representation of parameters for EPCOS ferrite materials.

source http://www.electronicproducts.com/Passive_Components/Magnetics_Inductors_Transformers/TDK_updates_magnetic_design_tool.aspx

TDK updates magnetic design tool

TDK enhances the functionality of its magnetic design tool to enable fast calculation and graphical representation of parameters for EPCOS ferrite materials.

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Silicon carbide delivers big improvements in power electronics

SiC technology’s electrical characteristics enable a significant reduction in system costs and an increase in overall efficiency.

source http://www.electronicproducts.com/Power_Products/Power_Semiconductors/Silicon_carbide_delivers_big_improvements_in_power_electronics.aspx

Silicon carbide delivers big improvements in power electronics

SiC technology’s electrical characteristics enable a significant reduction in system costs and an increase in overall efficiency.

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Silicon carbide delivers big improvements in power electronics

SiC technology’s electrical characteristics enable a significant reduction in system costs and an increase in overall efficiency.

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Vayyar claims first 60-GHz automotive radar-on-chip

Vayyar released a low-cost, 60-GHz version of its 79-GHz automotive-grade radar-on-chip, enabling the automotive industry to meet the Euro NCAP and U.S. Hot Cars Act requirements.

source http://www.electronicproducts.com/Sensors_and_Transducers/Image_Sensors_and_Optical_Detectors/Vayyar_claims_first_60_GHz_automotive_radar_on_chip.aspx

Motor control design: DC drivers for BLDCs

Part 3 in a series of articles on motor control design focuses on the selection of DC drivers.

source http://www.electronicproducts.com/Electromechanical_Components/Motors_and_Controllers/Motor_control_design_DC_drivers_for_BLDCs.aspx

Vayyar claims first 60-GHz automotive radar-on-chip

Vayyar released a low-cost, 60-GHz version of its 79-GHz automotive-grade radar-on-chip, enabling the automotive industry to meet the Euro NCAP and U.S. Hot Cars Act requirements.

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Motor control design: DC drivers for BLDCs

Part 3 in a series of articles on motor control design focuses on the selection of DC drivers.

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Automotive display PMIC shrinks solution size by up to 50%

Maxim’s integrated automotive display power management IC replaces four or five discrete ICs with a single chip, enabling designers to increase the number of displays in a vehicle.

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5G SoCs bring premium features to mid-range smartphones

MediaTek introduces a new Dimensity 800 Series 5G chipset SoC family that delivers flagship performance to mid-range 5G smartphones.

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Micron samples DDR5 RDIMMs for data centers

Delivering more than an 85% increase in memory performance compared to DDR4, Micron is sampling its advanced DDR5 RDIMMs, based on its 1z-nm process technology.

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PMIC simplifies power supply design in automotive cameras

The highly integrated Renesas ISL78083 automotive camera PMIC reduces development cycles, BOM cost, and supply chain risks.

 

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Automotive display PMIC shrinks solution size by up to 50%

Maxim’s integrated automotive display power management IC replaces four or five discrete ICs with a single chip, enabling designers to increase the number of displays in a vehicle.

source http://www.electronicproducts.com/Power_Products/Power_Management/Automotive_display_PMIC_shrinks_solution_size_by_up_to_50.aspx

5G SoCs bring premium features to mid-range smartphones

MediaTek introduces a new Dimensity 800 Series 5G chipset SoC family that delivers flagship performance to mid-range 5G smartphones.

source http://www.electronicproducts.com/Digital_ICs/SoCs_ASICs_ASSPs_MEMS/5G_SoCs_bring_premium_features_to_mid_range_smartphones.aspx

Micron samples DDR5 RDIMMs for data centers

Delivering more than an 85% increase in memory performance compared to DDR4, Micron is sampling its advanced DDR5 RDIMMs, based on its 1z-nm process technology.

source http://www.electronicproducts.com/Digital_ICs/Memory/Micron_samples_DDR5_RDIMMs_for_data_centers.aspx

PMIC simplifies power supply design in automotive cameras

The highly integrated Renesas ISL78083 automotive camera PMIC reduces development cycles, BOM cost, and supply chain risks.

 

source http://www.electronicproducts.com/Power_Products/Power_Management/PMIC_simplifies_power_supply_design_in_automotive_cameras.aspx

Murata and Google create smallest AI module

Murata and Google claim the smallest AI module using Coral’s AI platform with the Edge TPU ASIC to deliver high-performance and low-power neural network processing.

source http://www.electronicproducts.com/News/Murata_and_Google_create_smallest_AI_module.aspx

Fault tolerant IMUs target industrial applications

TDK’s fault tolerant InvenSense inertial measurement unit (IMU) family, targeted at industrial applications, can take precise measurements in harsh environments.

source http://www.electronicproducts.com/Sensors_and_Transducers/Sensors/Fault_tolerant_IMUs_target_industrial_applications.aspx

Murata and Google create smallest AI module

Murata and Google claim the smallest AI module using Coral’s AI platform with the Edge TPU ASIC to deliver high-performance and low-power neural network processing.

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Fault tolerant IMUs target industrial applications

TDK’s fault tolerant InvenSense inertial measurement unit (IMU) family, targeted at industrial applications, can take precise measurements in harsh environments.

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NXP unveils first i.MX applications processor with dedicated NPU

NXP Semiconductors’ new i.MX 8M Plus application processor is the first in the i.MX family with a dedicated neural processing unit (NPU) for machine learning at the industrial and IoT edge.

source http://www.electronicproducts.com/Digital_ICs/Microprocessors_Microcontrollers_DSPs/NXP_unveils_first_i_MX_applications_processor_with_dedicated_NPU.aspx

NXP unveils first i.MX applications processor with dedicated NPU

NXP Semiconductors’ new i.MX 8M Plus application processor is the first in the i.MX family with a dedicated neural processing unit (NPU) for machine learning at the industrial and IoT edge.

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48-MP image sensor integrates dual conversion gain HDR for smartphones

OmniVision claims the industry’s first 48-MP image sensor with on-chip dual conversion gain HDR and a 1.2-micron pixel size for smartphones.

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48-MP image sensor integrates dual conversion gain HDR for smartphones

OmniVision claims the industry’s first 48-MP image sensor with on-chip dual conversion gain HDR and a 1.2-micron pixel size for smartphones.

source http://www.electronicproducts.com/Sensors_and_Transducers/Image_Sensors_and_Optical_Detectors/48_MP_image_sensor_integrates_dual_conversion_gain_HDR_for_smartphones.aspx

Qorvo kit integrates Wi-Fi 6 and IoT for the connected home

Qorvo’s Wi-Fi 6 solution platform supports all tri-band Wi-Fi and major IoT protocols, speeding up time to market by delivering a wide range of connectivity in one box.

source http://www.electronicproducts.com/Analog_Mixed_Signal_ICs/Communications/Qorvo_kit_integrates_Wi_Fi_6_and_IoT_for_the_connected_home.aspx

Infineon launches smallest 3D image sensor

Targeting smartphones and other 3D image data applications, Infineon, in collaboration with pmdtechnologies, claims the industry’s smallest 3D image sensor, measuring 4.4 x 5.1 mm.

source http://www.electronicproducts.com/Sensors_and_Transducers/Image_Sensors_and_Optical_Detectors/Infineon_launches_smallest_3D_image_sensor.aspx

Qorvo kit integrates Wi-Fi 6 and IoT for the connected home

Qorvo’s Wi-Fi 6 solution platform supports all tri-band Wi-Fi and major IoT protocols, speeding up time to market by delivering a wide range of connectivity in one box.

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Infineon launches smallest 3D image sensor

Targeting smartphones and other 3D image data applications, Infineon, in collaboration with pmdtechnologies, claims the industry’s smallest 3D image sensor, measuring 4.4 x 5.1 mm.

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Synaptics demos HMI advances at CES

Synaptics showcases several new products at CES, including the new VideoSmart VS600 family of edge computing SoCs, the TD7850 automotive TDDI solution, and AudioSmart platform.

source http://www.electronicproducts.com/News/Synaptics_demos_HMI_advances_at_CES.aspx

Synaptics demos HMI advances at CES

Synaptics showcases several new products at CES, including the new VideoSmart VS600 family of edge computing SoCs, the TD7850 automotive TDDI solution, and AudioSmart platform.

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How to prevent lithium-ion battery disasters

Here are several design approaches to reduce the possibility of severe failures caused by thermal runaway in lithium-ion battery packs.

source http://www.electronicproducts.com/Power_Products/Batteries_and_Fuel_Cells/How_to_prevent_lithium_ion_battery_disasters.aspx

Microchip offers early access to PolarFire SoC FPGA

Microchip’s Early Access Program (EAP) for the RISC-V enabled low-power PolarFire SoC FPGA enables qualified customers to start designing now with the company’s design suite and integrated development environment ahead of availability in Q3 2020.

source http://www.electronicproducts.com/Digital_ICs/SoCs_ASICs_ASSPs_MEMS/Microchip_offers_early_access_to_PolarFire_SoC_FPGA.aspx

How to prevent lithium-ion battery disasters

Here are several design approaches to reduce the possibility of severe failures caused by thermal runaway in lithium-ion battery packs.

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Microchip offers early access to PolarFire SoC FPGA

Microchip’s Early Access Program (EAP) for the RISC-V enabled low-power PolarFire SoC FPGA enables qualified customers to start designing now with the company’s design suite and integrated development environment ahead of availability in Q3 2020.

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4K video processor solves power vs. resolution dilemma

OmniVision claims the industry’s lowest power consumption 4K video processor with HEVC compression capability for battery-powered security and surveillance.

source http://www.electronicproducts.com/Digital_ICs/Video_Graphics_Audio/4K_video_processor_solves_power_vs_resolution_dilemma.aspx

4K video processor solves power vs. resolution dilemma

OmniVision claims the industry’s lowest power consumption 4K video processor with HEVC compression capability for battery-powered security and surveillance.

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Year in review: top 10 components

Here’s a recap of Electronic Products’ top 10 component lists of 2019.

source http://www.electronicproducts.com/News/Year_in_review_top_10_components.aspx

Year in review: top 10 components

Here’s a recap of Electronic Products’ top 10 component lists of 2019.

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