Xilinx unveils industry’s largest FPGA

The Virtex UltraScale+ VU19P features 35 billion transistors, delivering the industry’s highest logic density and I/O count on a single chip.

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Wi-Fi connectivity cloud kit simplifies IoT connections

The Renesas RX65N Cloud Kit features a 32-bit RX65N MCU with Amazon FreeRTOS, Wi-Fi, and three sensors that connects to the AWS cloud.

source http://www.electronicproducts.com/Internet_of_Things/Wi_Fi_connectivity_cloud_kit_simplifies_IoT_connections.aspx

Heat shield for electronic devices measures 10 atoms thick

Looking at heat in electronic devices in a new way, Stanford researchers have developed a heat shield that is roughly 50,000× thinner than a sheet of paper.

source http://www.electronicproducts.com/News/Heat_shield_for_electronic_devices_measures_10_atoms_thick.aspx

Heat shield for electronic devices measures 10 atoms thick

Looking at heat in electronic devices in a new way, Stanford researchers have developed a heat shield that is roughly 50,000× thinner than a sheet of paper.

from Electronic Products Technology Center Articles https://ift.tt/30pggyz

Wi-Fi connectivity cloud kit simplifies IoT connections

The Renesas RX65N Cloud Kit features a 32-bit RX65N MCU with Amazon FreeRTOS, Wi-Fi, and three sensors that connects to the AWS cloud.

from Electronic Products Technology Center Articles https://ift.tt/2MwznTW

Heat shield for electronic devices measures 10 atoms thick

Looking at heat in electronic devices in a new way, Stanford researchers have developed a heat shield that is roughly 50,000× thinner than a sheet of paper.

from Electronic Products Technology Center Articles https://ift.tt/2KY7yRs

Balluff launches machine-vision configurator tool

Balluff’s configurator tool simplifies the selection and configuration of a complete machine vision system.

 

source http://www.electronicproducts.com/News/Balluff_launches_machine_vision_configurator_tool.aspx