Wednesday, August 28, 2019

Senseg claims first flexible actuator for haptic applications

Senseg creates a new category of flexible electronics with the launch of the industry’s first flexible actuators manufactured on roll-to-roll technology, delivering benefits in scalability, size, weight, and cost.



from Electronic Products Technology Center Articles https://ift.tt/2ZuYIE2

Monday, August 26, 2019

Hot Chips 2019 highlights new AI strategies

Machine learning and neural network processing took center stage at this year’s Hot Chips event with two different approaches to AI chips emerging.



source http://www.electronicproducts.com/News/Hot_Chips_2019_highlights_new_AI_strategies.aspx

Hot Chips 2019 highlights new AI strategies

Machine learning and neural network processing took center stage at this year’s Hot Chips event with two different approaches to AI chips emerging.



from Electronic Products Technology Center Articles https://ift.tt/2NzKgEg

Friday, August 23, 2019

Buck switchers deliver low standby current for always-on devices

Buck switchers with low standby current and high efficiency target low-power applications, and are particularly suited for small appliances and IoT endpoints.



from Electronic Products Technology Center Articles https://ift.tt/2LbcO4q

Thursday, August 22, 2019

Intel readies for ‘AI everywhere’

Intel shared more details about its upcoming Nervana neural network processors for AI training and inference.



from Electronic Products Technology Center Articles https://ift.tt/33VCFWj

Xilinx unveils industry’s largest FPGA

The Virtex UltraScale+ VU19P features 35 billion transistors, delivering the industry’s highest logic density and I/O count on a single chip.



source http://www.electronicproducts.com/Digital_ICs/Standard_and_Programmable_Logic/Xilinx_unveils_industry_s_largest_FPGA.aspx

Xilinx unveils industry’s largest FPGA

The Virtex UltraScale+ VU19P features 35 billion transistors, delivering the industry’s highest logic density and I/O count on a single chip.



from Electronic Products Technology Center Articles https://ift.tt/2HkwpOk