Powerbox claims the industry’s first power supply for immerged computing applications, delivering the lowest possible inrush current, and highest level of safety.
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Monday, November 25, 2019
Power supply optimized for immerged computing
from Electronic Products Technology Center Articles https://ift.tt/2sc26EF
BLDC fan driver improves thermal efficiency in data centers
Developed for data center applications, Allegro Microsystems claims the industry’s first three-phase BLDC driver with integrated power loss brake, which lowers BOM costs while improving thermal efficiency.
from Electronic Products Technology Center Articles https://ift.tt/2XQPiiT
Power supply optimized for immerged computing
Powerbox claims the industry’s first power supply for immerged computing applications, delivering the lowest possible inrush current, and highest level of safety.
from Electronic Products Technology Center Articles https://ift.tt/2QQ7w2H
BLDC fan driver improves thermal efficiency in data centers
Developed for data center applications, Allegro Microsystems claims the industry’s first three-phase BLDC driver with integrated power loss brake, which lowers BOM costs while improving thermal efficiency.
from Electronic Products Technology Center Articles https://ift.tt/2DgGsBu
Power transformer improves DC/DC power conversion efficiency
Bourns’ flyback power transformer delivers enhanced DC/DC power conversion efficiency in isolated mode, supporting IEEE 802.3 af-compliant, integrated PoE powered device, and PWM controller applications.
source http://www.electronicproducts.com/Passive_Components/Magnetics_Inductors_Transformers/Power_transformer_improves_DC_DC_power_conversion_efficiency.aspx
Renesas claims industry first ASi-5 ASSP for industrial automation
The ASi-5 ASSP offers easy fieldbus connectivity for sensors, actuators, and other industrial equipment, enabling faster transmission of larger data quantities and more efficient integration with smart sensors in industrial IoT applications.
source http://www.electronicproducts.com/Digital_ICs/SoCs_ASICs_ASSPs_MEMS/Renesas_claims_industry_first_ASi_5_ASSP_for_industrial_automation.aspx
Stacked connectors maximize PCB space
TE’s zSFP+ stacked belly-to-belly connectors support data rates up to 28 Gbits/s NRZ and 56 Gbits/s PAM-4 for hyperscale data centers and network switch applications.
source http://www.electronicproducts.com/Interconnections/Connectors/Stacked_connectors_maximize_PCB_space.aspx
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