Friday, October 25, 2019

Hybrid chips may solve thermal, efficiency, and integration challenges in 5G mobile devices

Hybrid chips, combining silicon-based CMOS and compound semiconductor technologies, delivers the best of both worlds for fast 5G networks.



source http://www.electronicproducts.com/News/Hybrid_chips_may_solve_thermal_efficiency_and_integration_challenges_in_5G_mobile_devices.aspx

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