Wednesday, June 3, 2020

Multi-chip capacitors address high-density packaging for power electronics

Kemet extends its KC-LINK capacitor family with high-density packaging for power applications that call for high-power density and high efficiency in a small package.



source http://www.electronicproducts.com/Passive_Components/Capacitors/Multi_chip_capacitors_address_high_density_packaging_for_power_electronics.aspx

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